Electronic Manufacturing Services PBCA | SAFARI CIRCUITS

Surface Mount Technology (SMT)

• Automated Screen Printing
• Solder Paste Optical Inspection
• Component placement
• PCBA reflow
• Automated Optical Inspection post reflow

Thru-Hole Technology (THT)

• Automated component insertion for radial, axial and DIP components
• Hand assembly for large mass components
• Wave soldering machines

Cleaning Technologies

• RO / DI water system
• Water soluble wash
• No-clean wash
• Ionic testing

Typical Component Types Used In The SMT And THT Assembly Process

• 01005, 0201, 0402, 0603, 0805, 1206, SMT packages
• QFP, QFN, DFN, PLCC
• Ball Grid Array (BGA), fine pitch / micro BGA
• Axial, radial and DIP leaded components

Test And Inspection

• AOI post screen printing and post relow
• Custom fixtured In-Circuit Testing
• Flying Probe In-Circuit Testing
• X-ray
• Functional test
• Manual Inspection performed by IPC Certified inspectors