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ASSEMBLY

RELIABLE ASSEMBLY OF EVEN THE MOST COMPLEX PROJECTS...
FROM BOARD TO BOX.

By allowing SAFARI to handle your EMS build requirements, you are assured greater stability in component costing while obtaining unsurpassed quality. From prototyping to ramp up and ongoing production, our manufacturing expertise can be a competitive asset to your global product marketing.

  • CIRCUIT BOARD ASSEMBLY FOR THT AND / OR SMT
  • ELECTRO-MECHANICAL MODULE ASSEMBLY
  • CABLE & WIRE ASSEMBLY
  • UNIT OR SUB-ASSEMBLY OR COMPLETE FINAL PRODUCT ASSEMBLY

Our focus on value engineering will help you achieve greater return on your contract EMS investment. Sourcing criteria for raw material focuses on 'total value' — competitive pricing, accountability tracing and on-time delivery. We can often recommend next-generation design or process modifications to improve performance or costing structure, while adhering to stringent quality and delivery standards.

SAFARI manufactures printed circuit board assemblies in a modern temperature controlled facility. Our capabilities encompass surface mount technology (SMT), through-hole technology (THT), BGA and Micro-BGA, with many being a combination of technologies. All printed circuit board assemblies are manufactured to IPC standards using state of the art equipment and associates trained to IPC standards.

Our expertise in the newest advancements in component and chip placement technology drives innovative solutions through design and manufacturing for your printed circuit board and product assemblies.

Surface Mount Technology (SMT)

  • Screen print and paste with solder paste measurement
  • Component placement
  • PCBA Reflow
  • Placement and nomenclature verification using Automated Optical Inspection (AOI)
  • ICT and/or functional testing
  • ESD final packaging and shipment

Typical component types used in the SMT and THT assembly process:

  • .01005, 0201, 0402, 0603, 0805, 1206, SMT packages
  • QFP, QFN, DFN, PLCC
  • Ball Grid Array (BGA), fine pitch / micro BGA
  • Axial and radial leaded components
  • DIP IC, Headers, ICs and sockets
  • ESD final packaging and shipment

Cleaning Technologies

  • RO / DI water system
  • Water soluble wash
  • No-clean wash
  • Ionic testing

Through-Hole Technology (THT)

  • Automated component insertion
  • Hand assembly for large mass components
  • Wave soldering
  • Secondary operations
  • ICT and/or Functional Testing
  • ESD final packaging and shipment